CVE-2023-33063
Published 2023-12-05 · Updated 2026-06-17 · Source product-security@qualcomm.com
Summary
CVE-2023-33063 is a high-severity (CVSS 7.8) vulnerability in Qualcomm Multiple Chipsets. CISA added it to the Known Exploited Vulnerabilities catalog on December 5, 2023, which means exploitation in the wild has been confirmed; US federal agencies had to remediate it by December 26, 2023. CISA does not currently list it as used in ransomware campaigns. Qualcomm has 12 vulnerabilities in the KEV catalog, 0 of them linked to ransomware.
All 12 known-exploited Qualcomm vulnerabilities →Description
Memory corruption in DSP Services during a remote call from HLOS to DSP.
CVSS vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
CISA Known-Exploited Vulnerability
Product: Qualcomm — Multiple Chipsets
Name: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Date added: 2023-12-05 · Due: 2023-12-26
Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

