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CVE-2023-33063

HIGH7.8
CISA KEV

Published 2023-12-05 · Updated 2026-06-17 · Source product-security@qualcomm.com

Summary

CVE-2023-33063 is a high-severity (CVSS 7.8) vulnerability in Qualcomm Multiple Chipsets. CISA added it to the Known Exploited Vulnerabilities catalog on December 5, 2023, which means exploitation in the wild has been confirmed; US federal agencies had to remediate it by December 26, 2023. CISA does not currently list it as used in ransomware campaigns. Qualcomm has 12 vulnerabilities in the KEV catalog, 0 of them linked to ransomware.

All 12 known-exploited Qualcomm vulnerabilities →

Description

Memory corruption in DSP Services during a remote call from HLOS to DSP.

CVSS vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

CWE-416CWE-416

CISA Known-Exploited Vulnerability

Product: Qualcomm — Multiple Chipsets

Name: Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Date added: 2023-12-05 · Due: 2023-12-26

Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

View on NVD